Ventiva, a cutting-edge technology company, has made a groundbreaking announcement at CES 2025, showcasing an innovative cooling system for low-TDP chips. Introducing ICE9, a 12mm-thick module that harnesses the power of molecular air ionization to create a silent and fan-free airflow. This technology is touted to revolutionize the cooling system for chips with TDP up to 25W, with plans to increase efficiency to 40W by 2027. While it may not replace traditional fan-based cooling systems entirely, ICE9 has the potential to significantly reduce fan noise and increase efficiency in laptops. Ventiva envisions applications not only in consumer electronics but also in compact workstations and specialized equipment. This technology has the potential to disrupt the cooling system landscape and bring about a new era of efficient and quiet computing solutions.