A senior director at Intel, who wishes to remain anonymous, has made a groundbreaking statement regarding the future of chip production. According to him, the introduction of new transistor architectures, such as GAAFET and CFET, will significantly reduce the dependence on cutting-edge lithography in the manufacturing process. This is because the precise removal of material using etching will become more crucial than further shrinking of element sizes using EUV scanners. As a result, the density of elements can be increased not only horizontally but also vertically, making the expensive lithographic equipment less critical. This breakthrough has the potential to revolutionize the field of chip production and may lead to the development of more efficient and powerful electronic devices.