Intel has recently disclosed the details of its 18A process node, which is set to replace the current Intel 3. The new process node boasts several key features, including the use of RibbonFET (GAA) transistors and PowerVia, a power delivery system that enables efficient power distribution to the chip's components. This results in a 39% increase in density, a 25% improvement in frequency at the same voltage, and a 38% reduction in power consumption at low voltages. The 18A process node is already being prepared for client CPUs, such as Panther Lake, and server CPUs, such as Xeon Clearwater Forest. The improved density, reduced RC delays, and lower voltage drops are expected to provide a significant boost to the performance and efficiency of Intel's future chips. Additionally, the company claims that the new process node will enable more efficient integration of SRAM and a simplified logic cell design, further enhancing the overall performance and power efficiency of the chips.