The Joint Electron Device Engineering Council (JEDEC) is gearing up to introduce a new memory standard called SPHBM4, which is designed to be a more cost-effective alternative to HBM4. Unlike HBM4, which requires expensive silicon substrates, SPHBM4 is optimized for standard organic substrates. This change enables the use of the same DRAM crystals as HBM4, but with a modified base interface crystal and a reduced number of data lines from 2048 to 512. To maintain the same level of throughput as HBM4, SPHBM4 relies on higher frequencies and 4:1 serialization. This approach reduces the cost of packaging and allows for longer traces between the System-on-Chip (SoC) and memory, making it possible to stack more layers and increase capacity. The introduction of SPHBM4 is expected to revolutionize the memory industry by providing a more affordable and efficient solution for high-performance applications.